100 v, 20 a, 34.4 m low r ds(on) n ch trench power mosfet GKI10526 g ki 10526- ds rev. 1. 6 sanken electric co.,ltd. 1 ma r. 11, 2 01 5 features ? v (br) dss -------------------------------- 100 v (i d = 100 a) ? i d ---------------------------------------------------------- 20 a ? r ds ( on ) ---------- 54.2 m max . (v gs = 10 v , i d = 9.3 a) ? q g ------- 9 .0 nc (v gs = 4.5 v, v ds = 50 v , i d = 11.9 a) ? low total gate charge ? high speed switching ? low on -resistance ? capable of 4.5 v gate drive ? 100 % uil tested ? rohs compliant applications ? dc -dc converters ? synchronous rectification ? power supplies package dfn 5 6 not to scale equivalent circuit absolute maximum ratings ? unless otherwise specified, t a = 25 c parameter symbol test conditions rating unit drain to source voltage v ds 100 v gate to source voltage v gs 20 v continuous drain current i d t c = 25 c , with infinite heatsink 20 a t a = 25 c , mounted on pcb* 4 a pulsed drain current i dm pw 100s duty cycle 1 % 40 a continuous source current (body diode) i s 20 a pulsed source current (body diode) i sm pw 100s duty cycle 1 % 40 a single pulse avalanche energy e as v dd = 50 v, l = 1 mh, i as = 6 .8 a, unclamped, r g = 4.7 , refer to figure 1 47 mj avalanche current i as 13.3 a power dissipation p d t c = 25 c , with infinite heatsink 46 w t a = 25 c , mounted on pcb* 3.1 w operating junction temperature t j 150 c storage temperature range t stg ? 55 to 150 c * 1 inch square 2 oz copper pad on 1.5 1.5 in ch pcb. d(5)(6)(7)(8) s(1)(2)(3) g(4) http://www.sanken-ele.co.jp s s s g d d d d g s s s d d d d 1pin 1pin 8pin 8pin downloaded from: http:///
g ki 10526 g ki 10526- ds rev. 1. 6 sanken electric co.,ltd. 2 ma r. 11, 2 01 5 thermal characteristics ? unless otherwise specified, t a = 25 c parameter symbol test conditions m in . t yp . m ax . unit thermal resistance ( junction to case) r jc ? ? 2.7 c/w thermal resistance ( junction to ambient) r ja mounted on pcb* ? ? 40.3 c/w * 1 inch square 2 oz copper pad on 1.5 1.5 inch pcb. electrical characteristics ? unless otherwise specified, t a = 25 c parameter symbol test conditions m in . t yp . m ax . unit drain to source breakdown voltage v (br) dss i d = 100 a, v gs = 0 v 100 ? ? v drain to source leakage current i dss v ds = 100 v, v gs = 0 v ? ? 100 a gate to source leakage current i gss v gs = 20 v ? ? 100 na gate threshold voltage v gs( th ) v ds = v gs , i d = 3 50 a 1.0 2.0 2.5 v static drain to source on -resistance r ds( on ) i d = 9.3 a, v gs = 10 v ? 34.4 54.2 m i d = 4.7 a, v gs = 4.5 v ? 36.3 56.2 m gate resistance r g f = 1 mhz ? 2.3 ? input capacitance c iss v ds = 25 v v gs = 0 v f = 1 mhz ? 1530 ? pf output capacitance c oss ? 125 ? reverse transfer capacitance c rss ? 51 ? total gate charge (v gs = 10 v) q g1 v ds = 50 v i d = 11.9 a ? 19.9 ? nc total gate charge (v gs = 4.5 v) q g2 ? 9.0 ? gate to source charge q gs ? 3. 6 ? gate to drain charge q gd ? 2.6 ? turn-on delay time t d(on) v dd = 50 v i d = 11.9 a v gs = 10 v, r g = 4.7 refer to figure 2 ? 3.0 ? ns rise time t r ? 2.8 ? turn-off delay time t d(off) ? 13.7 ? fall time t f ? 6.0 ? source to drain diode forward voltage v sd i s = 9.3 a, v gs = 0 v ? 0.9 1.5 v source to drain diode reverse recovery time t rr i f = 11.9 a di/dt = 100 a/s refer to figure 3 ? 40.7 ? ns source to drain diode reverse recovery charge q rr ? 68.2 ? nc downloaded from: http:///
g ki 10526 g ki 10526- ds rev. 1. 6 sanken electric co.,ltd. 3 ma r. 11, 2 01 5 test circuits and waveforms v dd i d v ds r g v gs 0 v l i as i d v (br)dss v dd v ds (a) test circuit (b) waveform figure 1 unclamped inductive switching v ds v dd r g r l v gs 0 v p.w. = 10 s duty cycle 1 % t d(on) t r t on t d(off) t f t off 90% 10% 90%10% v gs v ds (a) test circuit (b) waveform figure 2 switching time v gs 0 v i f r g l d.u.t. v dd 0 v i f t rr di/dt i rm 90 % i rm (a) test circuit (b) waveform figure 3 diode reverse recovery time dd (br)dss (br)dss 2 as as v v v il 2 1 e ? ? ?? ? downloaded from: http:///
g ki 10526 g ki 10526- ds rev. 1. 6 sanken electric co.,ltd. 4 ma r. 11, 2 01 5 0.0 0.2 0.4 0.6 0 5 10 15 vds (v) vgs (v) vds-vgs characteristics (typical) id=4.7a id=6.0a id=9.3a tc=25 0 5 10 15 0 5 10 15 20 vgs (v) qg (nc) vgs - qg characteristics (typical) tc=25 vds=50v id=11.9a 0 1 2 3 25 50 75 100 125 150 vth (v) tc ( ) vth-tc characteristics (typical) id=350ua vgs=vds 0 10 20 30 40 50 60 70 80 90 25 50 75 100 125 150 rds on (m ) tc ( ) rds(on)-tc characteristics (typical) id=9.3a vgs=10v 0 10 20 30 40 50 60 70 80 90 25 50 75 100 125 150 rds on (m ) tc ( ) rds(on)-tc characteristics (typical) id=4.7a vgs=4.5v 100 105 110 115 120 125 130 25 50 75 100 125 150 bvdss (v ) tc ( ) bvdss-tc characteristics (typical) id=1ma vgs=0v 10 100 1000 10000 0 10 20 30 40 50 capacitance (pf) vds (v) capacitance-vds characteristics (typical) ciss coss crss ta=25 vgs=0v f =1mhz 0 5 10 15 20 25 30 35 40 0 0.5 1 1.5 idr (a) vsd (v) idr- vsd characteristics (typical) tc=25 vgs=10v vgs=4.5v 3v 0v 0 5 10 15 20 25 30 35 40 0 0.5 1 1.5 idr (a) vsd (v) idr- vsd characteristics (typical) vds=0v tc =125 75 25 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 rds(on) (m ) id (a) rds(on)-id characteristics (typical) vgs=4.5v tc = 125 75 25 0 5 10 15 20 25 30 35 40 0 1 2 3 4 5 6 id (a) vgs (v) id -vgs characteristics (typical) vds=5v tc =125 75 25 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 rds(on) (m ) id (a) rds(on)-id characteristics (typical) vgs=10v tc = 125 75 25 downloaded from: http:///
g ki 10526 g ki 10526- ds rev. 1. 6 sanken electric co.,ltd. 5 ma r. 11, 2 01 5 0 10 20 30 40 50 0 50 100 150 (w) ta ( ) pd -ta derating 0.1 1 10 100 0.1 1 10 100 id (a) vds (v) safe operating area pt=100s id(pulse) max pt=1ms 1 shot tc=25 1.e- 02 1.e- 01 1.e+00 1.e+01 1.e- 04 1.e- 03 1.e- 02 1.e- 01 1.e+00 1.e+01 1.e+02 rth j-c ( /w) p.t. (sec) transient thermal resistance - pulse width tc = 25 1shot vds < 10v downloaded from: http:///
g ki 10526 g ki 10526- ds rev. 1. 6 sanken electric co.,ltd. 6 ma r. 11, 2 01 5 package outline dfn 5 6 notes: 1) dimension is in millimeters 2) pb -free. device composition compliant with the rohs directive marking diagram part number ymddxxxb gki sk lot number y is the last digit of the year (0 to 9) m is the month (1 to 9, o, n or d) dd is the date (two digit of 01 to 31) xxx is the suffix no. b expresses pb free pins symbol min. max. a 1.03 1.17 b 0.34 0.48 c 0.824 0.970 d 4.80 5.40 d1 4.11 4.31 d2 4.80 5.00 e 5.95 6.15 e1 5.65 5.85 e2 1.60 -- e l 0.05 0.25 l1 0.38 0.50 l2 0.38 0.50 h 3.30 3.50 i -- 0.18 1.27 downloaded from: http:///
g ki 10526 g ki 10526- ds rev. 1. 6 sanken electric co.,ltd. 7 ma r. 11, 2 01 5 operating precautions in the case that you use sanken products or design your products by us ing sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating ma y be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stress es such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperatu re, humidity etc. and thermal stress caused due to self-heating of semiconductor products. for these stresses, instantaneo us values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ics including power devices have large self-heating value, the degree of derating of junction tem perature affects the reliability significantly. because reliability can be affected adversely by improper storage environme nts and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5 to 3 5c) and the standard relative humidity (around 40 to 75%) ; avoid storage locations that experience extreme changes in temperature or h umidity. ? avoid locations where dust or harmful gases are present and avoid direct sunligh t. ? reinspect for rust on leads and solderability of the products that have bee n stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and w rong connections. ensure all test parameters are within the ratings specified by sanken for the products. remarks about using thermal silicone grease ? when thermal silicone grease is used, it shall be applied evenly and thinly. if more silicone grease than required is applied, it may produce excess stress. ? the thermal silicone grease that ha s been stored for a long period of time may cause cracks of th e greases, and it cause low radiation performance. in addition, the old grease may cause cr acks in the resin mold when screwing the products to a heatsink. ? fully consider preventing foreign materials from entering into the thermal silicone grease. when foreign material is immixed, radiation performance may be degraded or an insulation failu re may occur due to a damaged insulating plate. ? the thermal silicone greases that are recommended for the resin molded semicon ductor should be used. our recommended thermal silicone grease is the following, and equivalent of these. type suppliers g746 shin-etsu chemical co., ltd. yg6260 momentive performance materials japan llc sc102 dow corning toray co., ltd. soldering when soldering the products, please be sure to minimize the working time, within the following limits: ? reflow preheat ; 180 c / 90 30 s solder heating ; 250 c / 10 1s (260 c peak, 2 times) ? soldering iron ; 380 10 c / 3.5 0.5s (1 time) electrostatic discharge ? when handling the products, the operator must be grounded. grounded wr ist straps worn should have at least 1m of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. ? workbenches where the products are handled should be grounded and b e provided with conductive table and floor mats. ? when using measuring equipment such as a curve tracer, the equipment shou ld be grounded. ? when soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. ? the products should always be stored and transported in sanken shipp ing containers or conductive containers, or be wrapped in aluminum foil. downloaded from: http:///
g ki 10526 g ki 10526- ds rev. 1. 6 sanken electric co.,ltd. 8 ma r. 11, 2 01 5 important notes ? the contents in this document are subject to changes, for improvement a nd other purposes, without notice. mak e sure that this is the latest revision of the document before use. ? application examples, operation examples and recommend ed examples described in this document are quoted for the sole purpose of reference for the use of the products herein and sa nken can assume no responsibility for any infringement of industrial property rights, intellectual property rights, life, body, property or any other rights of sanken or any third party which may result from its use. ? unless otherwise agreed in writing by sanken, sanken makes no warran ties of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, including its accuracy, usefulness , and reliability, included in this document. ? although sanken undertakes to enhance the quality and reliability of its pr oducts, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. users of sank en products are requested to take, a t their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or mal function. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunicatio n equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where high er reliability is required (transportation equipment and its control systems, traffic signal control systems or equ ipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems , life support systems, etc.) is strictly prohibited. ? when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the produ cts, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as droppin g products caused during transportation out of sankens distribution network. ? the contents in this document must not be transcribed or copied without sanken s written consent. downloaded from: http:///
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